Sök i kursutbudet

Använda sökfunktionen för att hitta i Chalmers utbildningsutbud, både vad gäller kurser och program. När det finns en kurshemsida visas en hus-symbol som leder till denna sida. Tänk på att välja det läsår du vill se information om.
Sök program och utbildningsplaner


Institutionernas kurser för doktorander

​​​​​​​​​​​​​​​​​​​​

Kursplan för

Läsår
MKM105 - Introduction to microsystems packaging
 
Kursplanen fastställd 2013-02-14 av programansvarig (eller motsvarande)
Ägare: MPEES
7,5 Poäng
Betygskala: TH - Fem, Fyra, Tre, Underkänt
Utbildningsnivå: Avancerad nivå
Huvudområde: Elektroteknik
Institution: 59 - MIKROTEKNOLOGI OCH NANOVETENSKAP


Undervisningsspråk: Engelska
Sökbar för utbytesstudenter
Blockschema: B

Modul   Poängfördelning   Tentamensdatum
Lp1 Lp2 Lp3 Lp4 Sommarkurs Ej Lp
0104 Tentamen 7,5hp Betygskala: TH   7,5hp   20 Dec 2013 em M,  24 Apr 2014 fm V,  29 Aug 2014 em M

I program

MPEES EMBEDDED ELECTRONIC SYSTEM DESIGN, MSC PROGR, Årskurs 2 (valbar)
MPEES EMBEDDED ELECTRONIC SYSTEM DESIGN, MSC PROGR, Årskurs 1 (obligatoriskt valbar)
MPWPS WIRELESS, PHOTONICS AND SPACE ENGINEERING, MSC PROGR, Årskurs 2 (valbar)

Examinator:

Docent  Per Lundgren
Professor  Johan Liu



Behörighet:

För kurser inom Chalmers utbildningsprogram gäller samma behörighetskrav som till de(t) program kursen ingår i.

Kursspecifika förkunskaper

You should have a B.Sc. or equivalent in electrical engineering, engineering physics or mechanical engineering.

Syfte

The objective of the course is to give the students an insight of the fundamental materials, processes and thermal management principles and concepts for microsystem system packaging. The students will after the course understand the driving forces for the quick development and fast changes related to the microelectronics/microsystem industry and products. The students will be able to use the terminology within the packaging of the electronics and microsystem to deal with the issues in this area. The students shall also be able to master basic manufacturing, thermal management and packaging techniques at chip as well as at board level.

Lärandemål (efter fullgjord kurs ska studenten kunna)



  • describe microsystems, which includes fundamental technologies such as microelectronics, photonics and MEMS.
    define each one of these fundamental technologies and describe the key concepts in each one of them.


  • select appropriate package technologies for different devices.


  • suggest solutions to well defined problems concerning the role of packaging in microelectronics and microsystems, the fundamentals of electrical package design, single-chip and multichip packaging, IC assembly, wafer-level packaging, fundamentals of discrete, integrated and embedded passives, fundamentals of optoelectronics, microelectromechanical systems (MEMS), sealing and encapsulation, system-level Printed Wiring Board (PWB) technology and board assembly.


  • assess and compare different manufacturing processes and packaging technologies in order to make optimal choices.


  • discuss the challenges of thermal management in electronics in a meaningful way with a professional in the field.


  • describe heat transfer in a microsystem in a schematic diagram consisting of thermal resistors.


  • explain to a peer the physical mechanisms of thermal conduction, convection and radiation.


  • compare and determine the relative importance of different thermal transport mechanisms in realistic microelectronic scenarios.


  • calculate values for thermally relevant parameters (like the temperature) for a microsystem even if this requires making non-trivial assumptions.


  • make basic design considerations for cooling of electronics and MEMS.

Innehåll

A number of lectures will be organized to give a background on microsystems packaging and production. Also invited guests from the electronics industry will talk about the importance of the microelectronics industry, the complexity of microelectronic products and the specific problems related to them. In addition to this, exercises and laboratory work will enhance the students understanding of the basic concepts in microelectronics and microsystems packaging and production. The lectures and exercises will cover the following topics: introduction to microsystems packaging and production, components types, IC assembly and wafer level packaging, passives, packaging and techniques, MEMS packaging, sealing and encapsulation and sSystem-level PWB technology, board assembly, and packaging materials and processes.

Organisation

The organization of the course is the following:



  1. Lectures,

  2. Tutorials

  3. Home assignments

  4. Laboratory work (compulsory labs): Lab A: Reflow and wave soldering, Lab B:Stencil and Pick and Place, Lab C:Flip chip

  5. Company visit

  6. Technical report (includes written report and oral presentation)

Litteratur

Rao Tummala: Fundamentals of Microsystems Packaging , McGraw Hill, New York, USA, 2001, ISBN: 0-07-137169-9

Examination


  • Written examination with scale, failed, 3, 4 and 5.

  • Labs attended.

  • Visit attended.

  • Home assignments done.

  • Written report and oral presentation of the same.


Publicerad: må 13 jul 2020.