Syllabus for |
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| MKM125 - Reliability of microsystem products |
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| Owner: MTMAS |
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5,0 Credits (ECTS 7,5) |
| Grading: TH - Five, Four, Three, Not passed |
| Level: C |
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Department: 59 - MICROTECHNOLOGY AND NANOSCIENCE
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Teaching language: English
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Credit distribution |
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Examination dates |
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Sp1 |
Sp2 |
Sp3 |
Sp4 |
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No Sp |
| 0104 |
Examination |
5,0 c |
Grading: TH |
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5,0 c
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Contact examiner, |
Contact examiner, |
29 Aug 2007 pm V |
In programs
TAUTA AUTOMATION AND MECHATRONICS ENGENEERING, Year 4 (elective)
MTMAS MSc PROGR IN MICROSYSTEM INTEGRATION TECHNOLOGY, Year 1 (compulsory)
Examiner:
Professor
Johan Liu
Eligibility:
For single subject courses within Chalmers programmes the same eligibility requirements apply, as to the programme(s) that the course is part of.
Course specific prerequisites
You should have a B.Sc. or equivalent in electrical engineering, engineering physics or mechanical engineering.
Aim
The goal of the course is to give students overview of to methodologies for reliability assurance of microsystems hardware and presenting the principles, methodologies, approaches and tools for thermo-mechanical reliability analysis.
Content
The lecture and exercises will cover an introduction to reliability and methodologies for reliability assurance of microsystems hardware, failure mechanisms, material parameters, constitutive models, models for lifetime prediction as well as experimental techniques for determination of mechanical parameters such as stress and strain.
Laboratory experiments will cover measurement of mechanical properties of polymeric and metallic materials using Differential Scanning Calorimetry (DSC), ThermoGravimetri Analyser (TGA) and Dynamic Mechanical Analyser (DMA), Multi-Functional Mechanical Tester and Laser Interferometry strain analyzer.
Finally application examples using FEM is also given to show the capabilities of using FEM to solve microelectronics packaging related problem.
Organisation
1) Lectures.
2) Home problems and project.
3) Laboratory work:
Lab A: Dynamic property test for underfill (equipment: Dynamic Mechanical Analyzer 7e)
Lab B: Mechanism Properties of Lead-free solder (equipment: Instron 5548 Microtester)
Lab C: In-situ observation for thermal deformation for BGA (equipment: Moire Interferrometry)
Literature
Rao Tummala: Fundamentals of Microsystems packaging, McGraw-Hill, New York, USA, 2001. Chapter 5: Fundamentals of Design for Reliability; Suresh K. Sitaraman, Georgia Institute of Technology; Johan H.L. Pang, Technological University, Singapore and chapter 22:
Fundamentals of Thermo-mechanical Reliability; Jianmin Qu, Georgia Institute of Technology; Yifan Guo, Motorola, Inc.
Electronic Packaging Design, Materials, Processes and Reliability, John Lau et al, McGraw-Hill, 1998, ISBN 0-07-037135-0, chapter 4.
Selected chapters in the book Conductive Adhesives for Electronics Packaging , Johan Liu, Electrochemical Publications Ltd, Port Erin, Isle of Man, British Isles, Printed by Arrowsmith, Bristol, England, ISBN 0901150371, 1999.
Performance-Based Quality Assurance of Electronic Hardware, IVF-report by Per-Erik Tegehall.
Examination
Written examination.