Syllabus for |
|
| MKM105 - Introduction to microsystem integration technology |
| |
| Owner: MTMAS |
|
|
5,0 Credits (ECTS 7,5) |
| Grading: TH - Five, Four, Three, Not passed |
| Level: B |
|
Department: 59 - MICROTECHNOLOGY AND NANOSCIENCE
|
Teaching language: English
| Course module |
|
Credit distribution |
|
Examination dates |
|
Sp1 |
Sp2 |
Sp3 |
Sp4 |
|
No Sp |
| 0104 |
Examination |
5,0 c |
Grading: TH |
|
5,0 c
|
|
|
|
|
|
|
Contact examiner, |
28 Aug 2007 am V |
In programs
TELTA ELECTRICAL ENGINEERING, Year 4 (elective)
MTMAS MSc PROGR IN MICROSYSTEM INTEGRATION TECHNOLOGY, Year 1 (compulsory)
TAUTA AUTOMATION AND MECHATRONICS ENGENEERING, Year 4 (elective)
Examiner:
Professor
Johan Liu
Eligibility:
For single subject courses within Chalmers programmes the same eligibility requirements apply, as to the programme(s) that the course is part of.
Course specific prerequisites
You should have a B.Sc. or equivalent in electrical engineering, engineering physics or mechanical engineering.
Aim
The objective of the course is to give the students an insight of the
conditions and environment that they are going to work with after their studies if they choose the electronics industry. Basic concepts and knowledge about microelectronics and microsystems packaging and integration technology as well as production technology will be given. The students will after the course understand the driving forces for the quick development and fast change related to the microelectronics industry and to the microelectronic products.
Content
A number of lectures will be organized to give a background on microsystems packaging and production. Also invited guests from the electronics industry will talk about the importance of the microelectronics industry, the complexity of microelectronic products and the specific problems related to them. In addition to this, exercises and laboratory work will enhance the students understanding of the basic concepts in microelectronics and microsystems packaging and production. The lectures and exercises will cover the following topics: introduction to microsystems packaging and production, components types, IC assembly and wafer level packaging, passives, packaging and techniques, MEMS packaging, sealing and encapsulation and sSystem-level PWB technology, board assembly, and packaging materials and processes.
Organisation
The courses contains a number of lectures, exercises, three laborations and two company visits.
Literature
Rao Tummala: Fundamentals of Microsystems Packaging , McGraw Hill, New York, USA, 2001, ISBN: 0-07-137169-9
Examination
Written examination with scale, failed, 3, 4 and 5.