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Syllabus for

Academic year
MKM105 - Introduction to microsystem integration technology
 
Owner: MTMAS
5,0 Credits (ECTS 7,5)
Grading: TH - Five, Four, Three, Not passed
Level: A
Department: 59 - MICROTECHNOLOGY AND NANOSCIENCE


Teaching language: English

Course module   Credit distribution   Examination dates
Sp1 Sp2 Sp3 Sp4 No Sp
0104 Examination 5,0 c Grading: TH   5,0 c   Contact examiner

In programs

TAUTA AUTOMATION AND MECHATRONICS ENGENEERING, Year 4 (elective)
TELTA ELECTRICAL ENGINEERING, Year 4 (elective)
MTMAS MSc PROGR IN MICROSYSTEM INTEGRATION TECHNOLOGY, Year 1 (compulsory)

Examiner:

Professor  Johan Liu



Eligibility:

For single subject courses within Chalmers programmes the same eligibility requirements apply, as to the programme(s) that the course is part of.

Course specific prerequisites

You should have a B.Sc. or equivalent in electrical engineering, engineering physics or mechanical engineering.

Aim

The objective of the course is to give the students an insight of the
conditions and environment that they are going to work with after their studies if they choose the electronics industry. Basic concepts and knowledge about microelectronics and microsystems packaging and integration technology as well as production technology will be given. The students will after the course understand the driving forces for the quick development and fast change related to the microelectronics industry and to the microelectronic products.

Content

A number of lectures will be organized to give a background on microsystems packaging and production. Also invited guests from the electronics industry will talk about the importance of the microelectronics industry, the complexity of microelectronic products and the specific problems related to them. In addition to this, exercises and laboratory work will enhance the students understanding of the basic concepts in microelectronics and microsystems packaging and production. The lectures and exercises will cover the following topics: introduction to microsystems packaging and production, components types, IC assembly and wafer level packaging, passives, packaging and techniques, MEMS packaging, sealing and encapsulation and sSystem-level PWB technology, board assembly, and packaging materials and processes.

Organisation

The courses contains a number of lectures, exercises, three laborations and two company visits.

Literature

Rao Tummala: Fundamentals of Microsystems Packaging , McGraw Hill, New York, USA, 2001, ISBN: 0-07-137169-9

Examination

Written examination with scale, failed, 3, 4 and 5.


Page manager Published: Mon 28 Nov 2016.