Search programme

​Use the search function to search amongst programmes at Chalmers. The programme overview and the programme syllabus relating to your studies are generally from the academic year you began your studies.


Course syllabus for

Academic year
MKM105 - Introduction to microsystems packaging
Grunder till byggsätt för mikrosystem
Course syllabus adopted 2022-02-02 by Head of Programme (or corresponding)
Owner: MPEES
7,5 Credits
Grading: TH - Pass with distinction (5), Pass with credit (4), Pass (3), Fail
Education cycle: Second-cycle
Main field of study: Electrical Engineering

Course round 1

Teaching language: English
Application code: 15117
Open for exchange students: Yes
Block schedule: B+

Module   Credit distribution   Examination dates
Sp1 Sp2 Sp3 Sp4 Summer course No Sp
0104 Examination 7,5 c Grading: TH   7,5 c   13 Jan 2023 pm J,  04 Apr 2023 am J,  25 Aug 2023 pm J

In programs



Johan Liu

  Go to Course Homepage


General entry requirements for Master's level (second cycle)
Applicants enrolled in a programme at Chalmers where the course is included in the study programme are exempted from fulfilling the requirements above.

Specific entry requirements

English 6 (or by other approved means with the equivalent proficiency level)
Applicants enrolled in a programme at Chalmers where the course is included in the study programme are exempted from fulfilling the requirements above.

Course specific prerequisites

You should have a B.Sc. or equivalent in electrical engineering, engineering physics or mechanical engineering.


The objective of the course is to give the students an insight of the fundamental materials, processes and thermal management principles and concepts for microsystem system packaging. The students will after the course understand the driving forces for the quick development and fast changes related to the microelectronics/microsystem industry and products. The students will be able to use the terminology within the packaging of the electronics and microsystem to deal with the issues in this area. The students shall also be able to master basic manufacturing, thermal management and packaging techniques at chip as well as at board level.

Learning outcomes (after completion of the course the student should be able to)

  • Describe microsystems packaging of fundamental technologies such as microelectronics, photonics and MEMS. Define each one of these fundamental technologies and describe the key concepts for packaging in each one of them.
  • Select appropriate package technologies for different devices.
  • Suggest solutions to well defined problems concerning the role of packaging in microelectronics and microsystems, the fundamentals of electrical package design, single-chip and multichip packaging, IC assembly, wafer-level packaging, fundamentals of discrete, integrated and embedded passives, fundamentals of optoelectronics, microelectromechanical systems (MEMS), sealing and encapsulation, system-level Printed Wiring Board (PWB) technology and board assembly.
  • Assess and compare different manufacturing processes and packaging technologies in order to make optimal choices based on specific requirements.
  • Discuss the challenges of packaging and thermal management in electronics in a meaningful way with a professional in the field.
  • Describe heat transfer in a microsystem in a schematic diagram consisting of thermal resistors.
  • Compare and determine the relative importance of different thermal transport mechanisms in realistic microelectronic scenarios.
  • Make basic design considerations for cooling of microelectronics.
  • Choose appropriate materials for different packages based on material properties and design requirements.
  • Discuss the reasons for the differing reliability of different packages and packaging technologies.
  • Use simple characterization methods to determine thermal, mechanical and electrical properties as well as the reliability of packaging materials and electronics systems.
  • Explain the acceleration factor for reliability testing.
  • Choose the right reliability tests and characterization methods for components, interconnects for a packaged system.


A number of lectures will be organized to give a background on microsystems packaging and production. Also invited guests from the electronics industry will talk about the importance of the microelectronics industry, the complexity of microelectronic products and the specific problems related to them. In addition to this, exercises and laboratory work will enhance the students understanding of the basic concepts in microelectronics and microsystems packaging and production. The lectures and exercises will cover the following topics: introduction to microsystems packaging and production, components types, IC assembly and wafer level packaging, passives, packaging and techniques, MEMS packaging, sealing and encapsulation and System-level PWB technology, board assembly, and packaging materials and processes.


The organization of the course is the following:

  1. Lectures
  2. Tutorials
  3. Compulsory home assignments
  4. Compulsory laboratory work: Lab A: Surface mount technology, Lab B: Flip chip assembly technology, Lab C: Characterization of thermal conductivity
  5. Compulsory written hand-ins after laboratory work 
  6. Compulsory company visit
  7. Compulsory guest lectures


Rao Tummala: Device and Systems Packaging: Technologies and
Applications, Second Edition, McGraw Hill Education, New York, USA,
2019, ISBN: 978-1259861550

Examination including compulsory elements

  • Written examination with scale: not passed, 3, 4 and 5.
  • Home assignments with scale: not passed, 3, 4 and 5.
  • Laboratory work passed.
  • Approved written hand-ins after laboratory work.
  • Attendance at company visit.
  • Attendance at guest lectures.
  • Final grade is based on the written exam (90%) and home assignments (10%).

The course examiner may assess individual students in other ways than what is stated above if there are special reasons for doing so, for example if a student has a decision from Chalmers on educational support due to disability.

Page manager Published: Thu 03 Nov 2022.